DSC Fab Urgent: Task Report

Task Start End Duration Completed Dependencies Total Cost Assigned Planned Start Start Variance Constraint Start Planned End End Variance Constraint End
1) Capillary Formation 2019/8/9, 9:00 AM 2019/8/13, 9:00 PM 4d 2.5h 94% 2019/8/8, 9:00 AM
1.1) Stepper Alignmarker Patterning 2019/8/9, 9:00 AM 2019/8/9, 11:00 AM 2h 100% Sheng 2019/8/9, 9:00 AM
1.2) RIE Etcher for Alignmarker 2019/8/9, 11:00 AM 2019/8/9, 12:00 PM 1h 100% 1.1 Sheng 2019/8/9, 11:00 AM
1.3) LTO deposition for Wafer I and II 2019/8/9, 2:30 PM 2019/8/9, 10:30 PM 1d 100% 1.2 Sheng 2019/8/9, 2:30 PM
1.4) PSG deposition for Wafer III 2019/8/12, 9:00 AM 2019/8/12, 3:30 PM 4h 100% 1.2 Sheng 2019/8/12, 9:00 AM
1.5) Steppper for M1(PSG) 2019/8/12, 3:30 PM 2019/8/12, 5:30 PM 2h 100% 1.4 Sheng 2019/8/12, 9:00 AM
1.6) DRIE Isotropic Etch 2019/8/12, 5:30 PM 2019/8/12, 8:30 PM 3h 100% 1.5 Sheng 2019/8/12, 11:00 AM
1.7) Steppper for M1 2019/8/12, 9:00 AM 2019/8/12, 11:00 AM 2h 100% 1.3 Sheng 2019/8/12, 9:00 AM
1.8) DRIE Isotropic Etch 2019/8/12, 11:00 AM 2019/8/12, 4:30 PM 3h 100% 1.7 Sheng 2019/8/12, 11:00 AM
1.9) LTO deposition for sealing Wafer I and II 2019/8/12, 4:30 PM 2019/8/12, 9:00 PM 4.5h 100% 1.8 Sheng 2019/8/12, 4:30 PM
1.10) PSG deposition for sealing Wafer III 2019/8/13, 9:00 AM 2019/8/13, 4:00 PM 4.5h 50% 1.8, 1.6 Sheng 2019/8/13, 9:00 AM
1.11) PSG deposition for planar 2019/8/13, 4:00 PM 2019/8/13, 9:00 PM 5h 100% 1.10, 1.9 Sheng 2019/8/13, 9:00 AM
2) Al Patterning 2019/8/14, 9:00 AM 2019/8/14, 12:00 PM 3h 0% 1
2.1) 3180 Al deposition 2019/8/14, 9:00 AM 2019/8/14, 10:00 AM 1h 0% Sheng 2019/8/14, 9:00 AM
2.2) MA6 for M2 2019/8/14, 10:00 AM 2019/8/14, 11:00 AM 1h 0% 2.1 Sheng 2019/8/13, 5:30 PM
2.3) AST Metal Etch 2019/8/14, 11:00 AM 2019/8/14, 12:00 PM 1h 0% 2.2 Sheng 2019/8/13, 6:30 PM
3) Ti Patterning 2019/8/14, 2:30 PM 2019/8/14, 5:30 PM 3h 0% 2 2019/8/14, 7:00 AM
3.1) 3180 Ti deposition 2019/8/14, 2:30 PM 2019/8/14, 3:30 PM 1h 0% Sheng 2019/8/14, 9:00 AM
3.2) MA6 for M3 2019/8/14, 3:30 PM 2019/8/14, 4:30 PM 1h 0% 3.1 Sheng 2019/8/14, 10:00 AM
3.3) AST Metal Etch 2019/8/14, 4:30 PM 2019/8/14, 5:30 PM 1h 0% 3.2 Sheng 2019/8/14, 11:00 AM
4) Protection and Mask 2019/8/15, 9:00 AM 2019/8/15, 7:30 PM 1d 0% 3 2019/8/8, 9:00 AM
4.1) PECVD SiO2 2019/8/15, 9:00 AM 2019/8/15, 11:00 AM 2h 0% Sheng 2019/8/15, 9:00 AM
4.2) PECVD aSi 2019/8/15, 11:00 AM 2019/8/15, 3:30 PM 2h 0% 4.1 Sheng 2019/8/14, 4:30 PM
4.3) MA6 for M4 2019/8/15, 3:30 PM 2019/8/15, 4:30 PM 1h 0% 4.2 Sheng 2019/8/14, 6:30 PM
4.4) DRIE 2019/8/15, 4:30 PM 2019/8/15, 7:30 PM 3h 0% 4.3 Sheng 2019/8/14, 7:30 PM
5) Dicing 2019/8/16, 9:00 AM 2019/8/16, 11:00 AM 2h 0% 4 Sheng 2019/8/16, 9:00 AM
6) Release 2019/8/16, 11:00 AM 2019/8/16, 6:30 PM 5h 0% 5 2019/8/16, 11:00 AM
6.1) Trion Oxide Etch 2019/8/16, 11:00 AM 2019/8/16, 4:30 PM 3h 0% Sheng 2019/8/16, 11:00 AM
6.2) XeF2 Etch 2019/8/16, 4:30 PM 2019/8/16, 6:30 PM 2h 0% 6.1 Sheng 2019/8/16, 4:30 PM

Exported 2019/8/13