DSC Fab Urgent: Resource Timeline

Name Start Date End Date Duration % Complete Assignment Cost
Sheng 2019/8/9, 9:00 AM 2019/8/16, 6:30 PM 1w 2d 4h 61%
Stepper Alignmarker Patterning 2019/8/9, 9:00 AM 2019/8/9, 11:00 AM 2h 100%
RIE Etcher for Alignmarker 2019/8/9, 11:00 AM 2019/8/9, 12:00 PM 1h 100%
LTO deposition for Wafer I and II 2019/8/9, 2:30 PM 2019/8/9, 10:30 PM 1d 100%
PSG deposition for Wafer III 2019/8/12, 9:00 AM 2019/8/12, 3:30 PM 4h 100%
Steppper for M1 2019/8/12, 9:00 AM 2019/8/12, 11:00 AM 2h 100%
DRIE Isotropic Etch 2019/8/12, 11:00 AM 2019/8/12, 4:30 PM 3h 100%
Steppper for M1(PSG) 2019/8/12, 3:30 PM 2019/8/12, 5:30 PM 2h 100%
LTO deposition for sealing Wafer I and II 2019/8/12, 4:30 PM 2019/8/12, 9:00 PM 4.5h 100%
DRIE Isotropic Etch 2019/8/12, 5:30 PM 2019/8/12, 8:30 PM 3h 100%
PSG deposition for sealing Wafer III 2019/8/13, 9:00 AM 2019/8/13, 4:00 PM 4.5h 50%
PSG deposition for planar 2019/8/13, 4:00 PM 2019/8/13, 9:00 PM 5h 100%
3180 Al deposition 2019/8/14, 9:00 AM 2019/8/14, 10:00 AM 1h 0%
MA6 for M2 2019/8/14, 10:00 AM 2019/8/14, 11:00 AM 1h 0%
AST Metal Etch 2019/8/14, 11:00 AM 2019/8/14, 12:00 PM 1h 0%
3180 Ti deposition 2019/8/14, 2:30 PM 2019/8/14, 3:30 PM 1h 0%
MA6 for M3 2019/8/14, 3:30 PM 2019/8/14, 4:30 PM 1h 0%
AST Metal Etch 2019/8/14, 4:30 PM 2019/8/14, 5:30 PM 1h 0%
PECVD SiO2 2019/8/15, 9:00 AM 2019/8/15, 11:00 AM 2h 0%
PECVD aSi 2019/8/15, 11:00 AM 2019/8/15, 3:30 PM 2h 0%
MA6 for M4 2019/8/15, 3:30 PM 2019/8/15, 4:30 PM 1h 0%
DRIE 2019/8/15, 4:30 PM 2019/8/15, 7:30 PM 3h 0%
Dicing 2019/8/16, 9:00 AM 2019/8/16, 11:00 AM 2h 0%
Trion Oxide Etch 2019/8/16, 11:00 AM 2019/8/16, 4:30 PM 3h 0%
XeF2 Etch 2019/8/16, 4:30 PM 2019/8/16, 6:30 PM 2h 0%

Exported 2019/8/13