DSC Fab Urgent: Earned Value Analysis

Task Planned Value Earned Value Actual Cost Cost Variance Schedule Variance Estimate at Completion Budgeted at Completion Variance at Completion CPI SPI CV % SV % TCPI
1) Capillary Formation
1.1) Stepper Alignmarker Patterning
1.2) RIE Etcher for Alignmarker
1.3) LTO deposition for Wafer I and II
1.4) PSG deposition for Wafer III
1.5) Steppper for M1(PSG)
1.6) DRIE Isotropic Etch
1.7) Steppper for M1
1.8) DRIE Isotropic Etch
1.9) LTO deposition for sealing Wafer I and II
1.10) PSG deposition for sealing Wafer III
1.11) PSG deposition for planar
2) Al Patterning
2.1) 3180 Al deposition
2.2) MA6 for M2
2.3) AST Metal Etch
3) Ti Patterning
3.1) 3180 Ti deposition
3.2) MA6 for M3
3.3) AST Metal Etch
4) Protection and Mask
4.1) PECVD SiO2
4.2) PECVD aSi
4.3) MA6 for M4
4.4) DRIE
5) Dicing
6) Release
6.1) Trion Oxide Etch
6.2) XeF2 Etch

Exported 2019/8/13